Overview
Features and Benefits
- Integrated dual-channel RF front end
- 2-stage LNA and high power silicon SPDT switch
- On-chip bias and matching
- Single-supply operation
- High power handling at TCASE = 105°C
- LTE average power (9 dB PAR) full lifetime: 43 dBm
- Gain
- High gain mode: 36 dB typical at 3.6 GHz
- Low gain mode: 17 dB typical at 3.6 GHz
- Low noise figure
- High gain mode: 1.05 dB typical at 3.6 GHz
- Low gain mode: 1.05 dB typical at 3.6 GHz
- High isolation
- RXOUT-CHA and RXOUT-CHB: 47 dB typical
- TERM-CHA and TERM-CHB: 75 dB typical
- Low insertion loss: 0.5 dB typical at 3.6 GHz
- High OIP3: 35 dBm typical
- Power-down mode and low gain mode
- Low supply current
- High gain mode: 95 mA typical at 5 V
- Low gain mode: 48 mA typical at 5 V
- Power-down mode: 13 mA typical at 5 V
- Positive logic control
- 6 mm × 6 mm, 40-lead LFCSP package
- Pin compatible with the ADRF5515 and the ADRF5519, and the 10 W versions, ADRF5545A and ADRF5549
Product Details
The ADRF5515A is a dual-channel, integrated RF, front-end, multichip module designed for time division duplexing (TDD) applications. The device operates from 3.3 GHz to 4.0 GHz. The ADRF5515A is configured in dual channels with a cascading, two-stage low noise amplifier (LNA) and a high-power silicon singlepole, double-throw (SPDT) switch.
In high gain mode, the cascaded two-stage LNA and switch offer a low noise figure of 1.05 dB and a high gain of 36 dB at 3.6 GHz, with an output third-order intercept (OIP3) point of 35 dBm (typical). In low gain mode, one stage of the two-stage LNA is in bypass, providing 17 dB of gain at a lower current of 48 mA. In power-down mode, the LNAs are turned off and the device draws 13 mA.
In transmit operation, when RF inputs are connected to a termination pin (TERM-CHA or TERM-CHB), the switch provides low insertion loss of 0.5 dB and handles long-term evolution (LTE) average power (9 dB peak to average ratio (PAR)) of 43 dBm for full lifetime operation.
The device comes in an RoHS-compliant, compact, 6 mm × 6 mm, 40-lead lead frame chip scale package (LFCSP).
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This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
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